Thermal stresses must be accounted for and avoided in, for example,
the construction of railways, roads, or copper interconnects used in
microelectronic devices. Moreover, fluid-structure interaction (FSI) is
encountered in many different branches of engineering and science,
and on scales ranging from aircrafts and wind turbines to microsensors
in molecule detection.
All of these applications involve different phenomena coupled to each
other, and can only be simulated through Multiphysics Modeling.
This can be seen in the links below:
