Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Accurate geometry factor estimation for the four point probe method using COMSOL Multiphysics

Kalavagunta, A., Weller, R.A.
Vanderbilt University, Nashville, TN

The four-point probe is a tool for measuring the resistivity of a material by contact with its surface. The tool is widely used in the semiconductor industry and has applications both in research and manufacturing. The method though is quite sensitive to various paramaters like the substrate material, probe separation, probe depth etc. In this paper we show that COMSOL multiphysics can be used ...

Finite-element Analysis of Properties in Real and Idealized Photonic Crystal Fibres, Application to Supercontinuum Generation

Gérôme, F., Viale, P., Tombelaine, V., Leproux, P., Auguste, J.L., Février, S., Blondy, J.M., Couderc, V.
IRCOM, CNRS UMR 6615, Limoges, France

Using a full-vector finite-element method, we calculate modal properties in index-guiding photonic crystal fibres. The influence of the deformation of the geometry in actual fibre structures is evaluated and compared to the idealized-model. These results are applied to the supercontinuum generation. Moreover, development of MATLAB softwares for FEMLAB 3.1 are presented.

Using COMSOL Multiphysics Capability for Engineering High Q MEMS Resonators

Amy Duwel
Charles Stark Draper Laboratory
Cambridge, USA

Micromechanical resonators are used in a wide variety of applications, including inertial sensing, chemical and biological sensing, acoustic sensing, and microwave transceivers. Despite the distinct design requirements for each of these applications, a ubiquitous resonator performance parameter emerges. This is the resonator’s Quality factor (Q), which describes the mechanical energy damping. ...

Electromagnetics at Optical and Microwave Frequencies using COMSOL Multiphysics

Howie Stuart
Bell Laboratories, Lucent Technologies
Whippany, USA

The flexibility of COMSOL Multiphysics enables a variety of computational approaches to be applied towards solving electromagnetic problems across the whole spectrum. I will describe techniques for studying resonant electromagnetic interactions in a range of structures, including materials with negative electric permittivity (metals at optical frequencies), and small microwave resonators and ...

Mathematical modeling of nanomaterials

Strauss, D.J., Trenado, C.
Institute of New Materials, Saarbrücken

Mathematical modeling at the Institute of New Materials has played a crucial role in supporting the manufacturing and design of new technologies of nanomaterials, whose applications range from transportation, electronics and optics engineering to environmental sciences. In this paper, we focus our attention to two mathematical models together with their corresponding FEMLAB simulations: The ...

Numerical Simulation of Fluid Flow During Arc Welding

Carin, M.1, Favre, E.2
1 Laboratoire d’Etudes Thermiques Energétique et Environnement, Université de Bretagne Sud, Lorient, France
2 Comsol France, Grenoble, France

A 2D axisymmetric model of a melt pool created by an arc type heat source has been developed using FEMLAB. The model solves the coupled equations of laminar fluid flow and heat transfer to demonstrate the flow behaviour in the pool. The coupled effects of buoyancy and capillary forces are taken into account. The presence of the liquid – solid interface is modelled by two different ways: a ...

Modeling Thermal Stresses of Copper Interconnects in 3D IC Structures

Bentz, D.N., Zhang, J., Bloomfield, M., Lu, J-Q., Gutmann, R.J., Cale, T.S.
Rensselaer Polytechnic Institute

One of the key issues in developing higher density microelectronics devices is the impact of the stresses induced by thermal expansion mismatches of the materials used. We have examined, using FEMLAB, the stresses due to interwafer copper interconnects embedded in multilayer structures created by bonding two wafers using an organic low-k dielectric glue, benzocylcobutene (BCB). This work ...

Modelling of Thermal Stresses in Industrial Continuous Casting Processes

Åberg, J., Vynnycky, M., Fredriksson, H.
KTH/Metallernas Gjutning, Stockholm, Sweden

This paper reports on progress in the implementation of COMSOL Multiphysics 3.2 to model thermal stresses in a three-dimensional solidifying shell, as occurs typically in the industrial continuous casting of copper, copper alloys and steel. Computer memory requirements prohibit a direct 3D numerical simulation of the temperature and the stresses. Instead, we use the fact that casting ...

In Situ electric field simulation in Metal/Insulator/Metal (MIM) capacitors.

Gaillard, N., Pinzelli, L., Gros-Jean, M., Bsiesy, A.

In recent years, a large variety of high dielectric constant materials has been studied as an alternative to silicon dioxide in order to improve the electrical properties in many integrated devices. The authors pointed out MIM electrical properties modifications such as current-voltage shift and the decrease in the voltage gap between the different conduction mechanisms voltage threshold while ...

Modeling an integrated, high flow rate MEMS ferrofluid pump

Mao, L., Koser, H.
Department of Electrical Engineering, Yale University, New Haven, CT

We present a FEMLAB modeling study of an integrated, high-flow rate microfluidic pump for ferrofluids. Initial studies of these microfluidic devices have been performed using a onedimensional setup in MATLAB and later confirmed by corresponding simulations with FEMLAB 3.1 in partial differential equation (PDE) mode. It is determined that maximum flow velocity is achieved when the product of ...

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