Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Accurate Parameters Extraction of Multiconductor Transmission Lines in Multilayer Dielectric Media

S. Musa[1], M. Sadiku[1], and O. Momoh[2]
[1]Roy G. Perry College of Engineering, Prairie View A&M University, Prairie View, TX
[2]Indiana University-Purdue University

Development of very high speed integrated circuits is currently of great interest for today\'s technologies. This paper presents the quasi-TEM approach for the accurate parameters extraction of multiconductor transmission lines interconnect in single, two, and three-layered dielectric regions using the finite element method (FEM). We illustrate that FEM is accurate and effective for modeling ...

Finite Element Analysis of Integrated Circuit Interconnect Lines on Lossy Silicon Substrate

S. Musa[1], M. Sadiku[1], and A. Emam[2]

[1]Roy G. Perry College of Engineering, Prairie View A&M University, Prairie View, TX
[2]Information Systems Department, King Saud University, Riyadh, Saudi Arabia

The silicon substrate has a significant effect on the inductance parameter of a lossy interconnect line on an integrated circuit. It is essential to take this into account in determining the transmission line electrical parameters. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using the finite element ...

Optimization of a High-Temperature High-Pressure Direct Wafer Bonding Process for III-V Semiconductors

R. Martin, J. Kozak, K. Anglin, and W. Goodhue
University of Massachusetts Lowell
Lowell, MA

Many optoelectronic devices utilize a heterojunction of a pair semiconducting materials including high-efficiency MEMS devices, solar cells, LEDs, and VCSELs. One fabrication technique which achieves such a device is direct wafer fusion. To optimize the process, COMSOL Multiphysics 4.0 was used to test various geometric configurations of the fixture. 2D and 3D models were created in order ...

Single Crystal Diamond NEMS Switch

M. Liao
Optical and Electronic Materials Unit
National Institute for Materials Science
Japan

A single-crystal diamond NEMS switch was fabricated while batch production of SCD MEMS/NEMS structures were developed. The diamond NEMS switches exhibit high performance with respect to high controllability, high reproducibility, and good reliability. Modeling and simulations were made that were consistent with experiments.

Numerical Aspects of the Implementation of Artificial Boundary Conditions for Laminar Fluid-Structure Interactions

C. Boeckle[1], P. Wittwer[1]
[1]University of Geneva, Geneva, Switzerland

We discuss the implementation of artificial boundary conditions for stationary Navier-Stokes flows past bodies in the half-plane, for a range of low Reynolds numbers. When truncating the half-plane to a finite domain for numerical purposes, artificial boundaries appear. We present an explicit Dirichlet condition for the velocity at these boundaries in terms of an asymptotic expansion for the ...

Simulation of a Seal

V. Viola[1]
[1]CARCO, Basiano, Milano, Italy

Simulations of more than one type of seal have been done where the deformation and the stress of the seal itself or the pressure on the housing are of interest. According to the deformation of the seal we can modify the housing of the seal or its geometry depending on the design constraints to meet. Stresses on the seal are indicators of which changes have to be implemented on the geometry so to ...

Coupled Heat and Moisture Transfer in Building Components - Implementing WUFI® Approaches in COMSOL Multiphysics

B. Nusser[1], M. Teibinger[1]
[1]Holzforschung Austria, Vienna, Austria

Calculating time-dependent heat and moisture transports trough building components are important tasks in the area of building physics. A well known and worldwide used commercial software for this is WUFI®. From the scientific point of view the restricted access to governing equations is nevertheless a drawback of this software. In the present paper it is shown how the physical approaches used ...

Evaluation of Low-Cycle-Fatigue Life of Solder Joints in Surface Mounting Power Devices by Finite Element Modeling

N. Delmonte[1], F. Giuliani[1], M. Bernardoni[2], P. Cova[1]
[1]Dipartimento di Ingegneria dell'Informazione, Università degli Studi di Parma, Parma, Italy
[2]CDTR - Centre for Device Thermography and Reliability, H. H. Wills Dept. of Physics, University of Bristol, Bristol, United Kingdom

The reliability of solder joints [1,2] is one of the key factors in the determination of the reliability of the high power density electronic converters, being the solder joints both the mechanical, the electrical, and often the thermal connections between the electronic component and the board in which the component is placed. The main mechanism by which solder joints are damaged is thermal ...

Coupled Electric-Thermal-Fluid Analysis of High Voltage Bushing

G. Eriksson[1]
[1]ABB, Corporate Research, Västerås, Sweden

Modern power transmission systems are in general designed to operate at high voltages in order to reduce resistive losses generated by high currents. This, however, tends to increase the risk for dielectric breakdown or flashovers if the equipment is not properly designed to withstand the stress. The present work illustrates how multiphysics simulations can be used to analyze and predict the ...

Seasonal Thermal Performance of Geothermal Piles

D. Testi[1], P. Conti[1]
[1]University of Pisa, Department of Energy and Systems Engineering, Pisa, Italy

The use of foundation piles as ground heat exchangers coupled to a geothermal heat pump is considered of interest for possible savings in installation costs, compared to conventional borehole heat exchangers. We refer to them as “geothermal piles” or “energy piles”. The main purpose of the foundation structure is to transmit the load of the building to the lower layers of the soil, best ...

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