Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

3D Model for the Dynamic Simulation of SOFC Cathodes

A. Häffelin, J. Joos, M. Ender, A. Weber, and E. Ivers-Tiffée
Institut für Werkstoffe der Elektrotechnik (IWE)
Karlsruher Institut für Technologie (KIT)
Karlsruhe, Germany

A fuel cell is an electrochemical system, which converts chemical energy into electricity by a controlled reaction of hydrogen and oxygen. The performance of the electrode is likewise determined by its material and the microstructure. The simulations were performed directly on reconstructions of real electrodes, obtained from focused ion beam (FIB) tomography. A finite element method (FEM) ...

Near-Wellbore Physics of Non-Isothermal Flow Into a Wellbore and its Application to Hydrocarbon Production

J. Lowell

John Lovell received a Ph.D. in Electrical Engineering from Delft University in 1993 as well as MA\'s in Mathematics from Oxford and Cornell. He is currently a Business Development Manager for Schlumberger. His numerical expertise includes the creation and application of finite element algorithms for problems relating to the near-wellbore physics of hydrocarbon production from subterranean ...

Numerical Simulations of Ultrasonic Non Destructive Techniques of Masonry Buildings

S. Carcangiu[1], B. Cannas[1], M. Usai[1], and G. Concu[2]
[1]Department of Electric and Electronic Engineering, Cagliari, Italy
[2]Department of Structural and Infrastructural Engineering and Geomatics, Cagliari, Italy

An experimental program has been developed, with the purpose of evaluating the reliability in building diagnosis and characterization of an integrated analysis of several parameters, associated with acoustic waves propagating through the material. The Direct Transmission Technique has been applied. In this paper we developed a numerical model using the Transient Acoustics-Piezoelectric ...

Modelling Failure Mechanims in Sands Under Extreme Loads Using COMSOL

J. Mwebesa, D. Kalumba, and R. Kulabako
Makerere University
Kampala, Uganda

Studies by Nishaat (2009) showed that Terzaghi\'s bearing capacity model didn\'t adequately predict the bearing capacity failure in Philippi Dune sands. Nishaat carried out her investigation using a physical model that was built in a geotechnical laboratory. The failure surfaces she observed in the sands did not resemble those predicted by Terzaghi and Meyerhof\'s models. However the use of a ...

Using COMSOL for Smart Determination of Material Properties Using Inverse Modeling Techniques

J. van Schijndel, S. Uittenbosch, and T. Thomassen
Eindhoven University of Technology
Eindhoven, Netherlands

The paper presents the development of a method that determines building material and surface properties using relative simple and low-budget experiments, The method comprehends an optimal design of an experimental set up for smart determination of heat and moisture properties using both normal and inverse modeling techniques. It is concluded that the suggested methodology of the inverse ...

Benchmark of COMSOL vs. ROXIE Codes for the Calculation of a Particle Accelerator Quadrupole

I. Rodriguez, and J. L. Munoz
ESS Bilbao
Bilbao, Spain

The field quality requirements of most particle accelerator magnets are very tight and, therefore, very precise simulations are needed to accurately calculate these devices. CERN\'s ROXIE code is widely used as a reference software to calculate normal conducting and superconducting magnets for particle accelerator applications. ROXIE uses the full vector potential coupled to the BEM-FEM method ...

Advanced Multiphysics Actuation Model of Ionic Polymer-Metal Composites

D. Pugal[1], K. Kim[1], and A. Aabloo[2]
[1]ME Department, University of Nevada Reno, Reno, NV
[2]University of Tartu, Tartu, Estonia

Modeling electromechanical actuation of ionic polymer-metal composite (IPMC) material is considered in this work. Ionic current in the polymer is described with the Poisson-Nernst-Planck system of equations. Calculated ionic concentration is related to the deformation of the material. To include the effect of the electrodes, the ionic current and the electric current in the electrode domains is ...

Magnetic Nanoparticles for Novel Granular Spintronic Devices

A. Regtmeier[1], A. Weddemann[2], I. Ennen[3], and A. Hütten[1]
[1]Dept. of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany
[2]Dept. of Elect. Eng. and Comp. Science, Lab. for Electromagnetic and Electronic Syst., MIT, Cambridge, MA
[3]Institute of Solid State Physics, Vienna University of Technology, Vienna, Austria

Superparamagnetic nanoparticles have a wide range of applications in modern electric devices. Recent developments have identi fied them as components for a new type of magnetoresistance sensor. We propose a model for the numeric evaluation of the sensor properties. Based on the solutions of the Landau-Lifshitz-Gilbert equation for a set of homogeneously magnetized spheres arranged in highly ...

Finite Element Analysis of Integrated Circuit Interconnect Lines on Lossy Silicon Substrate

S. Musa[1], M. Sadiku[1], and A. Emam[2]

[1]Roy G. Perry College of Engineering, Prairie View A&M University, Prairie View, TX
[2]Information Systems Department, King Saud University, Riyadh, Saudi Arabia

The silicon substrate has a significant effect on the inductance parameter of a lossy interconnect line on an integrated circuit. It is essential to take this into account in determining the transmission line electrical parameters. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using the finite element ...

Optimization of a High-Temperature High-Pressure Direct Wafer Bonding Process for III-V Semiconductors

R. Martin, J. Kozak, K. Anglin, and W. Goodhue
University of Massachusetts Lowell
Lowell, MA

Many optoelectronic devices utilize a heterojunction of a pair semiconducting materials including high-efficiency MEMS devices, solar cells, LEDs, and VCSELs. One fabrication technique which achieves such a device is direct wafer fusion. To optimize the process, COMSOL Multiphysics 4.0 was used to test various geometric configurations of the fixture. 2D and 3D models were created in order ...

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